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  • AOS Expands Surface Mount Package offering with new LFPAK 5x6 Package for High Performance and High-Reliability Requirements

AOS Expands Surface Mount Package offering with new LFPAK 5x6 Package for High Performance and High-Reliability Requirements

New AOS LFPAK 5x6 package provides the ruggedness needed for high-current applications in industrial, server power, solar, and telecommunication applications

SUNNYVALE, Calif., Aug. 21, 2024Alpha and Omega Semiconductor Limited (AOS) (Nasdaq: AOSL), a designer, developer, and global supplier of a broad range of discrete power devices, wide band gap power devices, power management ICs, and modules, today announced its new highly robust power MOSFET LFPAK 5x6 package. AOS’s new LFPAK product offering is available in a wide range of voltages: 40V, 60V, and 100V, and it is designed to withstand harsh environments while maintaining MOSFET performance. The new devices are found in a broad range of applications such as industrial, server power, telecommunications, and solar, where high reliability is required. 

AOS’s LFPAK packaging enables higher board-level reliability due to key packaging features such as gull-wing leads, which offer a ruggedized solution for board-level environmental stresses. The gull-wing leads also enable optical inspection during PCBA manufacturing. Another feature enhancement is the LFPAK’s larger copper clip, which improves electrical and thermal performance. Advantages of the large clip include improved current handling capabilities, reduced on-resistance, and better heat dispersion compared to wire bonding. A large clip also has low parasitic inductance, enabling lower spike voltage in switching applications. All these features significantly improve the robustness of the MOSFET, and utilizing AOS’s advanced shielded gate MOSFET Technology (AlphaSGT™) enables designers to find an optimized solution to achieve high reliability under the harshest environmental conditions. 

“Designers have long trusted AOS power semiconductors in their applications, and LFPAK 5x6 will expand solution capability,” said Peter H. Wilson, Marketing Sr. Director of the MOSFET product line at AOS.

Technical Highlights

Part Number

VDS 
(v)

VGS 
(±v)

ID 
@ 25°C (A)

RDS(ON) max (mΩ) 
at VGS=10V

Tj max 
(°C)

AOLF66412

40

20 

352 

1.5

175

AOLF66413

40 

20 

374 

1.5

175

AOLF66417

40

20

20

2.6

175

AOLF66610

60

20

294

2

175

AOLF66910

100

20

187 

4.7

175

 

Pricing and Availability 

The LFPAK 5x6 family is immediately available in production quantities with a lead time of 14-16 weeks. The unit price for 1,000 pieces: